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Thermagon T-Flex 6100 Highly Compressible Gap Filling Interface Pad Condition: New (you'll get what you see in picture) Size : 47mm X 66mm Highly Compressible Gap Filler with 3 W/mK Very high compressibility for low stress applications 3 W/mK thermal conductivity Available in 19 thicknesses 0.020" (0.5mm) to 0.200" (5.0mm) Naturally tacky needing no further adhesive coating Applications Include: Cooling Components to the Chassis or Frame High Speed Mass Storage Drives RDRAM Memory Modules Heat Pipe Thermal Solutions Automotive Engine Control Units Telecommunication Hardware